Principal SIPI Engineer — 3D Packaging & HBM Expert

SK hynix America is hiring a Principal Engineer to lead SIPI strategy for next‑gen packaging and HBM integration. You’ll drive architecture, validation, and sign‑off across the full stack from silicon to substrate in collaboration with global R&D teams.

The role demands deep experience in high‑speed interfaces, EM extraction, and industry standards, with a track record of guiding multi‑disciplinary teams to deliver robust packaging solutions.