Senior Process Engineer — Flip Chip & 3D Packaging (Hybrid)

Langham Recruitment client in San Diego seeks a Senior Process Engineer to own development, optimization and scaling of manufacturing processes for advanced optoelectronic products. Hybrid work model with strong collaboration across engineering, suppliers and contract manufacturers.

The role focuses on Flip Chip packaging, Thermo-Compression Bonding, 2.5D/3D architectures, DOE experiments, and process reliability to drive yield, performance and scalable production.